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Nano Energy & Heat Transfer Lab.

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Methodology for Residue-Free Fabrication of van der Waals Heterostructures of Two-Dimensional Materials (Submitted)
  • AuthorLee, M., Kim, C., Seol, J. H.*
  • Year2025
  • Source-

Residue-free fabrication of two-dimensional materials using van der Waals interactions Under review
  • AuthorLee, M., Kim, C., Kwon, S.-Y., Lee, K., Kwak, G., Lim, H., Seol, J. H.*
  • Year2025
  • Source-

Quasiballistic thermal transport in submicron-scale graphene nanoribbons at room-temperature
  • AuthorS. So, J. H. Seol*, J. Lee*
  • Year2024
  • SourceNanoscale Advances

Thermal convective effect on the performance of thermally regenerative electrochemical cycle against self-discharge
  • AuthorJaehoon Kim*, Yeongcheol Park*, Joo-Hyoung Lee, Jae Hun Seol
  • Year2023
  • SourceApplied Thermal Engineering

Enhancing the thermal conductivity of amorphous polyimide by molecular-scale manipulation
  • AuthorDohun Yoon*, Hyunjung Lee*, Taehoon Kim*, Youngbin Song, Taeyeon Lee, Jongho Lee, Jae Hun Seol
  • Year2023
  • SourceEuropean Polymer Journal 184, 111775

A Study on Thermally Regenerative Electrochemical Cycles Using Various Supercapacitors
  • AuthorJaehoon kim, Sung Hoon Kim, Jongho Lee, Jae Hun Seol
  • Year2022
  • SourceApplied Thermal Engineering 217(25), 119200

In situ and Operando Thermal Characterization in Aqueous Electric Double Layer Capacitors Using the 3ω Hot-Wire Method
  • AuthorYeongcheol Park, Jaehoon Kim, Changho Kim, Seung-Mo Lee, Chul Kang, Jae Hun Seol
  • Year2022
  • SourceInternational Journal of Heat and Mass Transfer 188(1), 122632

Continuous Power Production Using Flowable Electrodes Based on Waste-heat Assisted Capacitive Mixing
  • AuthorHonggil Kim*, Jaehoon Kim*, Sung Hoon Kim, Jae Hun Seol
  • Year2022
  • SourceApplied Thermal Engineering 206, 118094

Active photonic wireless power transfer into live tissues
  • AuthorJuho Kim, Jimin Seo, Dongwuk Jung, Taeyeon Lee, Hunpyo Ju, Junkyu Han, Namyun Kim, Jinmo Jeong, Sungbum Cho, Jae Hun Seol, and Jongho Lee
  • Year2020
  • SourcePNAS 117 (29) 16856-16863

Electromagnetic Interference Shield of Highly Thermal-Conducting, Light-Weight, and Flexible Electrospun Nylon 66 Nanofiber-Silver Multi-Layer Film
  • AuthorJ. Kim*, S. Lee*, C. Kim*, Y. Park, M.-H. Kim, J. H. Seol
  • Year2020
  • SourcePolymers 12(8), 1805, 1-19
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